Multi-block sputtering target and associated methods and articles
US10727032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2019 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Jan 3, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 μm width (e.g., less than about 50 μm width). A process for making the target includes hot isostatically pressing, below a temperature of 1080° C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.