Patent · US Active

System and method for wafer-scale fabrication of free standing mechanical and photonic structures by ion beam etching

US10727072B2 · kind B2 · utility

2Cited by

5References

14Claims

0Family size

Assignee

President and Fellows of Harvard College · US

Inventors

Haig Avedis Atikian · Somerville, US
Marko Loncar · Somerville, US

Key dates

Filing date	May 13, 2016
Grant date	Jul 28, 2020
Priority date	—
Expiry date	May 13, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/056
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for fabrication of free standing mechanical and photonic structures is presented. A resist mask is applied to a bulk substrate. The bulk substrate is attached to a movable platform. The bulk substrate is exposed to an ion stream produced by a reactive ion beam etching source. The platform is moved relative to the ion stream to facilitate undercutting a portion of the bulk substrate otherwise shielded by the mask.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.