Method of making a peeled substrate using laser irradiation
US10727129B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 19, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | May 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02527
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate manufacturing method includes: a first step of disposing a condenser for condensing a laser beam in a non-contact manner on a surface 20r of a magnesium oxide single crystal substrate 20 to be irradiated; and a second step of irradiating a laser beam to a surface of the magnesium oxide single crystal substrate 20 and condensing the laser beam into an inner portion of the single crystal member under designated irradiation conditions using the condenser, and at a same time, two-dimensionally moving the condenser and the magnesium oxide single crystal substrate 20 relatively to each other, and sequentially forming processing marks to sequentially allow planar peeling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.