Thermally superconducting heat dissipation device and manufacturing method thereof
US10727149B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2016 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Dec 26, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2215/06
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermally superconducting radiator and a method for manufacturing the same. The thermally superconducting radiator comprises a plurality of separators and a plurality of thermally superconducting heat dissipation fins. The separators and the thermally superconducting heat dissipation fins are alternately arranged, and one end face of the separator is flush with one end face of the thermally superconducting heat dissipation fin, together forming a mounting surface suitable for mounting a power device. The thermally superconducting heat dissipation fins and the separators are fixedly connected. Replacing the conventional heat dissipation fins in the prior art with the thermally superconducting heat dissipation fins enables the thermally superconducting radiator to have a greater heat transfer rate and a more efficient fin efficiency. The fin efficiency of the heat dissipation fin is not affected by the height, which greatly improves the cooling capability of the radiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.