Thermal management component

US10727160B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Devdatta P. Kulkarni · Austin, US
• Richard J. Dischler · Bolton, US
• Je-Young Chang · San Jose, US

Key dates

• Filing date: Dec 29, 2017
• Grant date: Jul 28, 2020
• Expiry date: Dec 29, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Thermal management technology is disclosed. A thermal management component in accordance with the present disclosure can comprise a heat spreader having a plurality of microchannels. The thermal management component can also comprise a plurality of fins directly coupled to the heat spreader to provide surface area for heat transfer. In another aspect, a thermal management component can comprise a heat spreader having a plurality of microchannels, and an inlet port and an outlet port in fluid communication with the plurality of microchannels. The thermal management component can also comprise a plurality of fins coupled to the heat spreader to provide surface area for heat transfer. Additionally, the thermal management component can comprise a fluid conduit thermally coupled to the plurality of fins and fluidly coupled to the outlet port and the inlet port to facilitate flow of a heat transfer fluid through the microchannels and the fluid conduit. Associated electronic devices, systems, and methods are also disclosed.