Power module and power conversion system including same
US10727173B2 · kind B2 · utility
4Cited by
4References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 7, 2017 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | May 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module includes an upper substrate comprising a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; a lower substrate including a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; and a semiconductor element having an upper terminal and a lower terminal, the upper terminal and the lower terminal being bonded to a lower surface of the upper substrate and an upper surface of the lower substrate, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.