Die-in-die-cavity packaging

US10727203B1 · kind B1 · utility

Assignee

• Rockwell Collins, Inc. · US

Inventors

• Reginald D. Bean · Center Point, US
• Brandon C. Hamilton · Marion, US
• Steven J. Wiebers · Center Point, US
• Alan P. Boone · Swisher, US

Key dates

• Filing date: May 8, 2018
• Grant date: Jul 28, 2020
• Expiry date: May 8, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/10157
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A system-in-package (SIP) incorporating die-in-die cavity packaging may include hybrid dies fabricated by milling or otherwise creating a cavity through the additive surfaces of a primary application specific integrated circuit (ASIC) die configured for flip-chip bonding and encapsulating a secondary die such as a Flash/non-volatile memory module, analog-digital converter (ADC), or other processing circuit into the cavity. The primary and secondary dies are then connected by the addition of redistribution layers. The resulting hybrid die may then be vertically integrated into the SIP along with additional memory modules or dies.