Optoelectronic device module having a silicon interposer
US10727368B2 · kind B2 · utility
2Cited by
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 1, 2016 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Apr 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Optoelectronic device modules having a silicon photonics transmitter die connected to a silicon interposer are described. In an example, the optoelectronic device module includes a silicon photonics transmitter die connected to a silicon interposer, and the silicon interposer is disposed between the silicon photonics transmitter die and a substrate. The silicon interposer provides an electrical interconnect between the silicon photonics transmitter die and the substrate, and reduces a likelihood that a hybrid silicon laser on the silicon photonics transmitter die will be damaged during module operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.