Light emitting device, light emitting element and method for manufacturing the light emitting element
US10727385B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2019 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Feb 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
Abstract
According to one embodiment, a light emitting device includes a first lead, a light emitting element, and a first bonding member. The light emitting element includes a semiconductor stacked body and a first electrode. The semiconductor stacked body includes a light emitting layer. The first electrode is below the semiconductor stacked body. The first bonding member electrically connects the first lead and the first electrode. A lower surface of the first electrode includes a first protrusion, a second protrusion, and a first depression. The first depression is located between the first and second protrusions. The first protrusion has a first side surface. The second protrusion has a second side surface facing the first side surface. The first bonding member contacts at least a part of the first side surface. At least a part of the second side surface is separated from the first bonding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.