Conduction path
US10727655B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 18, 2019 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Mar 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02G3/128
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a technique that improves the heat dissipation properties of a wire that is arranged in a conduction path. A conduction path has a wire, a routing member that is made of a metal and has a routing groove in which the wire is routed, a bracket that is made of a metal and has a first mounting portion that is mounted to the routing member and has a second mounting portion that is mounted to an electrical connection box, and a heat transfer member that is made of a synthetic resin having a higher heat conductivity than air and is arranged in the routing groove and interposed between the wire and the routing member, in a region that corresponds to a portion of the routing member to which the first mounting portion is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.