Electronic device with heat radiation structure using audio device
US10728640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Sep 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/345
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device with a heat radiation structure using an audio device is provided. The electronic device includes a first housing, a speaker module disposed on a surface of the first housing and configured to output sounds in a first direction, a sound reflection plate mounted above the surface of the first housing and having a first surface facing the speaker module, and a heat emission device disposed on a second surface of the sound reflection plate. The sound reflection plate may absorb heat generated from the heat emission device, and discharge the absorbed heat to the outside of the electronic device through a space between the surface of the first housing and the first surface of the sound reflection plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.