Patent · US Active

Socket cavity insulator

US10729010B2 · kind B2 · utility

0Cited by

3References

11Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Daniel Willis · Lafayette, US
Dan H. Gerbus · Beaverton, US

Key dates

Filing date	Mar 30, 2018
Grant date	Jul 28, 2020
Priority date	—
Expiry date	Mar 30, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10515
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present subject matter may include an electronic device. The electronic device may include a motherboard socket body. The motherboard socket body may be adapted to couple with a processor. The motherboard socket body may define an aperture in the motherboard socket body. The electronic device may include a socket insulator. The socket insulator may be coupled with the aperture in the motherboard socket body. The socket insulator may include an insulator body that may be sized and shaped to close the aperture in the motherboard socket body. The socket insulator may be configured to isolate electrical communication in portions of the motherboard socket body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.