Method for producing an electronic assembly, and electronic assembly, in particular for a transmission control module

US10729023B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Peter Zweigle · Ditzingen, DE
• Helmut Deringer · Erligheim, DE
• Jens Hoffmann · Darmstadt, DE

Key dates

• Filing date: Sep 1, 2017
• Grant date: Jul 28, 2020
• Expiry date: Sep 1, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A method for producing an electronic assembly includes providing a printed circuit board with a first face, a second face facing away from the first face, and a first component arranged on the first face. The method further includes arranging the circuit board such that the second face lies on a reference surface, and applying a sealing material which is substantially not flowable prior to being cured onto the first face. The sealing material surrounds a sub-region of the first face of the circuit board. The method further includes arranging a second component at least partly on the reference surface such that the second component is pressed into the sealing material, electrically connecting the second component to the circuit board via an electric connection line, and applying a covering material onto the circuit board first face sub-region surrounded by the sealing material and onto the first component.