Heat-exchanging mold assemblies for infiltrated downhole tools
US10730106B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Mar 15, 2018 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Oct 27, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An example system for fabricating an infiltrated downhole tool includes a mold assembly having one or more component parts and defining an infiltration chamber to receive and contain matrix reinforcement materials and a binder material used to form the infiltrated downhole tool. One or more thermal conduits are positioned within the one or more component parts for circulating a thermal fluid through at least one of the one or more component parts and thereby placing the thermal fluid in thermal communication with the infiltration chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.