System and method for handling a component
US10730243B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Sep 24, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2309/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system for handling a first component includes: a main-device and a module-device, the module-device having a pressing section arranged to form an outer surface of the module-device, the module-device configured to releasably receive the first component, such that a connection section of the first component is attachable to the pressing section of the module-device. The module-device is releasably connected to a second component, wherein the main-device includes a grabbing unit adapted for releasably connecting the module-device, such that the pressing section is arranged to form a first outer surface section of the main-device, and wherein the main-device includes a connector for connecting to a handling-unit for arranging the main-device at the second component, such that the connection section of the first component, if attached to the pressing section of the module-device, is at least indirectly attachable to a front surface of the second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.