MEMS sensor, especially pressure sensor, for metrological registering of a measured variable

US10730741B2 · kind B2 · utility

Assignee

• Endress+Hauser SE+Co. KG · DE

Inventors

• Rafael Teipen · Berlin, DE
• Benjamin Lemke · Berlin, DE

Key dates

• Filing date: Mar 4, 2016
• Grant date: Aug 4, 2020
• Expiry date: Dec 20, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/0132
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A MEMS sensor with improved overload resistance for metrological registering of a measured variable comprises a plurality of layers, especially silicon layers, arranged on one another. The layers include at least one inner layer, which is arranged between a first layer and a second layer, and in the inner layer there is provided extending perpendicularly to the plane of the inner layer through the inner layer at least one cavity, on which borders externally at least sectionally and forming a connecting element, a region of the inner layer, which is connected with the first layer and the second layer. A lateral surface of the connecting element externally at least sectionally bordering the cavity has in an end region facing the first layer a rounding decreasing the cross sectional area of the cavity in the direction of the first layer, and has in an end region facing the second layer a rounding decreasing the cross sectional area of the cavity in the direction of the second layer.