Composition for bonding
US10731233B2 · kind B2 · utility
7Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2018 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jun 30, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C27/08
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.