Vacuum arc deposition apparatus and deposition method
US10731245B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Nov 8, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32064
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vacuum arc deposition apparatus for forming a ta-C film on a substrate using arc discharge includes a holding unit that holds a target unit, an anode unit into which electrons emitted from the target unit flow, and a power supply that supplies, between the target unit and the anode unit, a current for generating a plasma by arc discharge. The current supplied by the power supply at the time of the arc discharge is generated by superimposing, on a DC current, a pulse current of a pulse frequency not higher than 140 Hz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.