Bottom-up method for forming wire structures upon a substrate
US10731268B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Mar 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for forming structures upon a substrate. The method comprises: depositing fluid onto a substrate so as to define a wetted region, the fluid containing electrically polahzable nanoparticles; applying an alternating electric field to the fluid on the region, using a first electrode and a second electrode, so that a plurality of the nanoparticles are assembled to form an elongate structure extending from the first electrode towards the second electrode; and removing the fluid such that the elongate structure remains upon the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.