Flexible and compliant thermal interface materials with ultrahigh thermal conductivities
US10731269B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Mar 17, 2016 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jun 8, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/932
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface materials (TIMs) can be used in electronic devices to dissipate heat more effectively and efficiently. Nanocomposites have been prepared using functionalized boron nitride nanosheets (BNNS). The incorporation of soft-ligand functionalized BNNS in a metal matrix was used to nanofabricate kinetically-trapped nanocomposites TIMs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.