Patent · US Active

Filament with light-emitting semiconductor chips, lighting means and method of producing a filament

US10731797B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Thomas Schlereth · Pentling, DE
Elena Rachkova · Pielenhofen, DE
Michael Bestele · Lappersdorf, DE
Ivar Tangring · Regensburg, DE

Key dates

Filing date	Mar 23, 2017
Grant date	Aug 4, 2020
Priority date	—
Expiry date	Mar 23, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/882
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A filament includes a multiplicity of light-emitting semiconductor chips, wherein the semiconductor chips are arranged on a carrier, the semiconductor chips being electrically contacted, a scattering structure is configured to scatter light of the light-emitting semiconductor chips, the scattering structure is formed by structuring a surface, a converter covers the light-emitting semiconductor chips, and the structuring of the surface is formed on a surface of the converter.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.