Vapor chamber sealing method and structre using the same
US10731924B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0283
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Disclosed are a vapor chamber sealing method and a structure using the method. An upper plate and a lower plate used for making a plate of a vapor chamber are prepared, and outer edges of the upper and lower plates are formed into mutually attached sealed edges, and then the sealed edges of the upper and lower plates are aligned and engaged with each other to form a chamber between the upper and lower plates, and a sealing structure is formed and combined with the sealed edges of the upper and lower plates by an injection molding method, and the sealing structure is formed around and combined with the sealed edges of the upper and lower plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.