Integrated haptic system
US10732714B2 · kind B2 · utility
30Cited by
57References
57Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Sep 16, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/044
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.