Interposer for multi-layer display architecture
US10733930B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 23, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Sep 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer device including device layers connected by an interposer. For example, an electronic display may include a light emitting diode (LED) layer including LEDs and a control circuitry layer to provide control signals to the LEDs. The electronic display further includes an interposer positioned between the LED layer and the control circuitry layer. The interposer includes a substrate and an array of conductive pillars extending through the substrate. The conductive pillars electrically connect the LED layer with the control circuitry layer. Bonding layers may be formed on the interposer and a corresponding side of a device layer to facilitate a hybrid bonding process that electrically connects contacts of the device layer to the conductive pillars and joins the bonding layers to attach the device layer to the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.