Methods of reinforcing integrated circuitry of semiconductor devices and related semiconductor devices and packages
US10734298B2 · kind B2 · utility
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4References
23Claims
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Key dates
| Filing date | Sep 4, 2018 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Sep 4, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of making a semiconductor device packages may involve placing a metal material at least partially around a region of integrated circuitry embedded within an active surface of a semiconductor die, the metal material located on the active surface. At least a portion of the metal material may be left electrically disconnected from the region of integrated circuitry. The semiconductor die and the metal material may be encapsulated in an encapsulant material, the encapsulant material extending to a height above the active surface higher than a maximum height of the metal material above the active surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.