Patent · US Active

Method and apparatus of operating a compressible thermal interface

US10734302B2 · kind B2 · utility

0Cited by

3References

10Claims

0Family size

Assignee

KULR TECHNOLOGY CORPORATION · US

Inventors

Mysore Purushotham Divakar · San Jose, US
Juergen Mueller · Berlin, DE
Michael Mo · Taipei, TW

Key dates

Filing date	Jan 14, 2019
Grant date	Aug 4, 2020
Priority date	—
Expiry date	Jan 31, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A thermal electrical (TE) interface comprises a primary fiber thermal interface (FTI) having a first side configured to contact a heatsink, and a second side. The primary fiber thermal interface has a thickness ranging from 0.3 mm to 4 mm. A secondary fiber thermal interface (FTI) has a first side configured to contact the second side of the primary FTI, a second side configured to contact circuit components to dissipate heat from the circuit components through the first side of the primary FTI. The secondary fiber thermal interface has a thickness equal to or greater than the primary FTI.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.