Through-holes of a semiconductor chip
US10734322B2 · kind B2 · utility
2Cited by
2References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 7, 2019 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Nov 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One semiconductor chip includes a substrate having insulation properties, a plurality of bump electrodes provided on one surface of the substrate, a plurality of recesses provided in the other surface of the substrate, and a solder layer disposed within the recesses. The recesses are formed such that the area of the opening decreases from the other surface side toward the one surface side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.