Apparatus and method for packaging components
US10734349B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2016 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jan 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/951
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A component packaging apparatus includes: at least one component supply device; at least one component processing device, which is configured to process components provided by the component supply device; at least one component transfer device, each component transfer device respectively having multiple bond heads, each bond head transferring one of the said components which are processed by the component processing device; wherein the component processing device comprises a pick-up platform, which is configured to simultaneously arrange the multiple components, and the multiple bond heads are configured to pick up the multiple components simultaneously from the pick-up platform at one time. A method for packaging components is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.