Adhesive bonding composition and method of use
US10734353B2 · kind B2 · utility
4Cited by
4References
38Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jul 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0569
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.