Method for manufacturing thermal insulation film, thermal insulation structure, and display device
US10734592B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 9, 2019 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for manufacturing a thermal insulation film, a thermal insulation structure, and a display device. The method for manufacturing the thermal insulation film includes: providing a substrate; forming a sacrificial layer on the substrate; forming a thermal insulation layer on the sacrificial layer, the thermal insulation layer including at least one opening capable of exposing a portion of the sacrificial layer; and etching the sacrificial layer through the opening, so as to form a plurality of hollow holes between the thermal insulation layer and the substrate. A method for manufacturing the thermal insulation film according to the present disclosure is used for manufacturing a thermal insulation film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.