Method and system for optical alignment to a silicon photonically-enabled integrated circuit
US10735100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2019 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jul 23, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.