Semiconductor device
US10736238B2 · kind B2 · utility
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1References
4Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 31, 2019 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Jan 31, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess or a cavity may be provided at the center portion of the contact plate, the recess facing the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.