Dressing apparatus and wafer polishing apparatus comprising same
US10737366B2 · kind B2 · utility
4Cited by
0References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2016 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An embodiment according to the present invention relates to a dressing apparatus for cleaning a polishing pad attached to a lower surface plate, the dressing apparatus comprising: a brushing part comprising a brush; a cleaning solution spray unit, comprising a spray nozzle, for spraying the polishing pad with cleaning solution; and a suction unit, comprising a suction inlet, for suctioning particles generated when the cleaning solution is sprayed by the cleaning solution spray unit, wherein the brushing unit, cleaning solution spray unit and suction unit are attached to each other and swing above the polishing pad in unison.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.