Methods and systems for decorating molded plastic articles having uneven surfaces or hollow structures
US10737414B1 · kind B1 · utility
2Cited by
7References
14Claims
0Family size
Inventors
Key dates
| Filing date | May 20, 2020 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | May 20, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/722
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Methods, apparatus and system for decorating plastic articles having an uneven surface or hollow structure are disclosed. An assembly comprising a transfer pad and a flexible heat transfer die comprising a thermal interface material (TIM) replace the hard rubber die in a hot-stamping process to fuse indicia into the surface. The assembly modifies ordinary pad printing into a hot-stamping process that transfers indicia onto uneven surfaces. A pad printing machine or other robotics is used to move the assembly from a position of heating to a position of compressing the ink transfer to the surface of the article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.