Metal plating compositions
US10738039B2 · kind B2 · utility
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Key dates
| Filing date | Apr 28, 2015 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | May 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W36/0079
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.