Nanoclay filled barrier adhesive compositions
US10738224B2 · kind B2 · utility
1Cited by
18References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2016 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Jan 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/844
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A barrier adhesive composition comprising a resin system and organically modified nanoclay. The resin system comprises (a) a first polyisobutylene resin having a viscosity average molecular weight of about 300,000 to about 500,000 g/mol, (b) a second polyisobutylene resin having a viscosity average molecular of about 700,000 to about 900,000 g/mol and (c) tackifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.