Single-component thermosetting epoxy resin with improved adhesion
US10738226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2017 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Feb 8, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A one-component heat-curing epoxy resin adhesive has at least one epoxy resin having an average of more than one epoxy group per molecule; at least one latent hardener for epoxy resins; and at least one carboxylic acid selected from substituted or unsubstituted adipic acid, substituted or unsubstituted succinic acid, substituted or unsubstituted phthalic acid, substituted or unsubstituted terephthalic acid, substituted or unsubstituted isophthalic acid, substituted or unsubstituted benzenetricarboxylic acid and substituted or unsubstituted nitrobenzoic acid, excluding 2-hydroxysuccinic acid and 2,3-dihydroxysuccinic acid as carboxylic acid, and wherein the epoxy resin adhesive contains 0.0015 to 0.04 mol of the at least one carboxylic acid per 100 g of the epoxy resin adhesive and the epoxy resin adhesive has a viscosity of 500-5000 Pas at 25° C. The epoxy resin adhesive is notable for a very heat-resistant bond on particular metal substrates such as steel having a zinc-magnesium coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.