Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
US10738388B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Oct 8, 2015 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Apr 3, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.