Thermophile assembly with heat sink
US10738998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink assembly draws heat away from the cold junction of a thermopile element to increase the thermopile's power output. In one example, the heat sink assembly includes a first thermally conductive securing mechanism, a second thermally conductive securing mechanism, and a thermally conductive tube having a first end and a second end. The first end of the thermally conductive tube is secured between the first securing mechanism and the second securing mechanism. In some cases, the first end of the thermally conductive tube may include a flanged region adjacent the first end with at least part of the flange region secured between the first securing mechanism and the second securing mechanism. The flange may help with heat transfer to the thermally conductive tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.