Patent · US Active

Multiply polymer composite device with enclosed components, method for producing multiply polymer composite devices with enclosed components and device for producing multiply polymer composite devices with enclosed components

US10740668B2 · kind B2 · utility

0Cited by
0References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 4, 2018
Grant dateAug 11, 2020
Priority date
Expiry dateJun 4, 2038

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2425/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A polymer composite device comprises a first thermoplastic covering layer of a polymer material with a first softening temperature and a second thermoplastic covering layer of a polymer material with a second softening temperature. The polymer composite device also comprises a carrier layer, which is arranged between the first covering layer and the second covering layer. An inner layer, which comprises at least a first thermoplastic inner layer ply of a polymer material with a third softening temperature, is arranged between the first covering layer and the second covering layer. The inner layer at least partially surrounds the carrier layer in a material-bonding manner. The third softening temperature is lower than the first softening temperature and lower than the second softening temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.