Multiply polymer composite device with enclosed components, method for producing multiply polymer composite devices with enclosed components and device for producing multiply polymer composite devices with enclosed components
US10740668B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2018 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Jun 4, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2425/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A polymer composite device comprises a first thermoplastic covering layer of a polymer material with a first softening temperature and a second thermoplastic covering layer of a polymer material with a second softening temperature. The polymer composite device also comprises a carrier layer, which is arranged between the first covering layer and the second covering layer. An inner layer, which comprises at least a first thermoplastic inner layer ply of a polymer material with a third softening temperature, is arranged between the first covering layer and the second covering layer. The inner layer at least partially surrounds the carrier layer in a material-bonding manner. The third softening temperature is lower than the first softening temperature and lower than the second softening temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.