Patent · US Active

Component module and power module

US10741474B2 · kind B2 · utility

1Cited by

2References

17Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventor

Stefan Stegmeier · Munich, DE

Key dates

Filing date	Aug 2, 2016
Grant date	Aug 11, 2020
Priority date	—
Expiry date	Aug 2, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The disclosed component module includes a component comprising at least one electric contact to which at least one porous contact piece is connected; the component module further includes a cooling system for fluid-based cooling, said cooling system comprising one or more cooling ducts which are formed by pores of the porous contact piece. The disclosed power module comprises a component module of said type.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.