Optical element stack assemblies
US10741613B2 · kind B2 · utility
1Cited by
13References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2015 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Oct 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/005
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.