Compact opto-electronic modules and fabrication methods for such modules
US10741736B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Mar 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.