Patent · US Active

Micro LED transferring method, micro LED display panel and micro LED display device

US10741739B2 · kind B2 · utility

3Cited by

0References

18Claims

0Family size

Inventors

Zeshang HE · Shanghai, CN
Liang Xing · Shanghai, CN
Jujian Fu · Shanghai, CN
Gang Liu · Shanghai, CN

Key dates

Filing date	Jan 10, 2019
Grant date	Aug 11, 2020
Priority date	—
Expiry date	Jan 27, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/819
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A Micro LED transferring method, a Micro LED display panel and a Micro LED display device are provided. The Micro LED display panel includes a substrate, a pixel defining layer including multiple openings, first conducting layer located in the multiple openings, photosensitive conductive bonding layers and Micro LED structures. The photosensitive conductive bonding layer is solidified after receiving light, such that elements adhered on two opposite surfaces of the photosensitive conductive bonding layer are bonded together. Due to the photosensitive conductive bonding layer, a Micro LED is detected during a transferring process rather than after a bonding process, thereby eliminating a step of removing a bonded abnormal Micro LED, thus simplifying the detecting and repairing processes of Micro LEDs.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.