Copper foil having improved adhesive force, electrode including the same, secondary battery including the same, and method of manufacturing the same
US10741848B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Mar 7, 2018 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Aug 3, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 μm to 3.5 μm, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.