Lightweight spiral antenna array packaging approach
US10741907B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2018 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Apr 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/36
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The system and method for lightweight spiral antenna array packaging uses a foam core and metallic elements such that the foam core is machined to accept the folded metallic elements to create a compact and light weight assembly. The assembly can be bonded to other assemblies to form arrays. The array is then encapsulated in a prepreg fiberglass skin with a conductive layer of fabric/screen therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.