Network devices and network elements with stacked octal small format pluggable modules
US10741943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2018 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/53
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board (PCB). The apparatus also includes a first dual stacked octal small format pluggable (OSFP) module coupled to the PCB on a top surface of the PCB. The first dual stacked OSFP module comprises two OSFP modules that are vertically stacked. The apparatus further includes a second dual stacked OSFP module coupled to the PCB on a bottom surface of the PCB. The second dual stacked OSFP module comprises two OSFP modules that are vertically stacked. A first bottom of the first dual stacked OSFP module is flush against the top surface of the PCB. A second bottom of the second dual stacked OSFP is flush against the bottom surface of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.