Electronic devices having integrated antenna structures
US10742250B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2019 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Sep 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B5/48
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device may include a display formed at a front face and a backside circuitry module formed at a rear face that opposes the front face. The backside circuitry module may be surrounded by coil structures and may be aligned with a protrusion in a rear wall housing at the rear face. The backside circuitry module may include a substrate to which sensor components or other components may be mounted. In particular, sensor circuitry, sensors, transceiver circuitry, connector circuitry, etc. may be mounted to the substrate. Antenna structures may be embedded within the substrate along with conductive paths for the sensor components and other components mounted to the substrate. Support structures in the backside circuitry module may support the substrate, sensor components, and other components. If desired, antenna structures may be formed on the support structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.