Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
US10743112B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 14, 2017 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Jun 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The microphone and pressure sensor package comprises a carrier (1) with an opening (16), a microphone device (20) including a diaphragm (21) and a perforated back plate (22) arranged above the opening (16), an ASIC device (6), and a cover (9) forming a cavity (17) between the carrier (1) and the cover (9). The ASIC device (6) and the microphone device (20) are arranged in the cavity (17). A sensor element (7) provided for a pressure sensor is integrated in the ASIC device (6). The pressure outside the cavity (17) is transferred to the sensor element (7) through the opening (16), the diaphragm (21), and the back plate (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.