Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component
US10743411B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 8, 2020 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Jan 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic substrate component suitable for high-power chips includes a ceramic substrate body and at least one raised metal pad. The ceramic substrate body has an upper surface and a lower surface opposite to the upper surface. The raised metal pad includes a base portion and a top layer. The base portion, which is attached to the upper surface of the ceramic substrate body, has a thickness between 10 and 300 micrometers, and a thermal expansion coefficient greater than the ceramic substrate body. The top layer is formed on the base portion and adapted to install a high-power chip thereon. The top layer extends an area less than the base portion but greater than the high-power chip, and has a thermal expansion coefficient greater than the ceramic substrate body. As such, damages due to thermal stress occurring between the base portion and the ceramic substrate body can be mitigated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.